ucc39161 low current hot swap power manager slus410c -- november 1999 -- revised february 2000 1 post office box 655303 dallas, texas 75265 d integrated circuit breaker function d integrated 0.2- power fet d 1 ai cc when disabled d programmable on time d accurate 0.8-a (max) current d fixed 3 % duty cycle d unidirectional switch d thermal shutdown description the ucc39161 low-current hot-swap power manager provides complete power management, hot-swap capability, and circuit-breaker functions with minimal external components. for most applications, the only external component required to operate the device, other then supply bypassing, is a timing capacitor that sets the fault time. the maximum current level is internally programmed for 0.8 a. while the output current is below 0.8 a, the internal power mosfet is switched on at a nominal 220 m . when the output current exceeds 0.8 a, the mosfet transitions from a switch to a constant current source and the fault timer starts charging ct. once the fault time is reached, the current shuts off for a time, which equates to a 3% duty cycle. the ucc39161 also provides unidirectional current flow, emulating a diode in series with the power mosfet. the ucc39161 can be put into sleep mode by grounding the shtdwn pin. in sleep mode, the ucc39161 draws under 5 a of supply current. other features include thermal shutdown and a low thermal-resistance small-outline power package. block diagram 8 output + ? + output current sense h=open reverse voltage comparator 30mv charge pump power fet + ? + ? on time control 3% duty cycle linear current amplifier thermal shutdown internal bias + ? 1.5v 5 shtdwn 4 ct over current comparator 2 3 6 7 gnd gnd gnd gnd maximum current level 0.8a 4 heatsink pins load c load c t 1 vin 4v to 6v v in c in udg-99168 copyright 2000, texas instruments incorporated production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. soic 8-pin dp package (top view)
ucc39161 low current hot swap power manager slus410c -- november 1999 -- revised february 2000 2 post office box 655303 dallas, texas 75265 absolute maximum ratings over operating free-air temperature (unless otherwise noted) ?? input voltage (vin) 6v ......................................................................... output current, dc self limiting .................................................................. output current, pulse (less than 100 ns ) 20 a ...................................................... storage temperature, t stg -- 6 5 c to 150 c ........................................................ junction temperature, t j -- 55 c to 150 c ......................................................... lead temperature (soldering, 10 sec) 300 c ...................................................... ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditions? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ? currents are positive into, negative out of the specified terminal. consult packaging section of databook for thermal limitations and considerations of packages. electrical characteristics at t j =0 cto70 c, vin = 5 v, shtdwn =2.4v,t a =t j (unless otherwise noted) (see note 1) parameter test conditions min typ max units supply current section i cc supply current 1.00 2.00 ma i cc supply current (sleep mode) shtdwn =0.2v 0.50 5 a output section voltage drop i out =0.5a 0.10 0.16 v max current -- 1 . 0 -- 0 . 8 -- 0 . 6 a r e v e r s e l e a k a g e vin = 4.5 v, v out =5v 6 20 a reverse leakage vin = 0 v, v out =5v 0.50 9 a soft start time initial startup 50 s short circuit response 100 ns fault section ct charge current v ct =1.0v -- 4 5 --36.0 -- 2 7 a ct discharge current v ct =1.0v 0.90 1.0 1.50 a output duty cycle v o =0v 2.00 3.00 6.00 % ct charge threshold 0.4 0.5 0.6 v ct discharge threshold 1.2 1.4 1.8 v thermal shutdown 170 c thermal hysteresis 10 c shutdown section shutdown threshold 1.5 3.0 v shutdown hysteresis 150 300 mv shutdown bias current shtdwn =1.0v 100 500 na note: all voltages are with respect to ground.
ucc39161 low current hot swap power manager slus410c -- november 1999 -- revised february 2000 3 post office box 655303 dallas, texas 75265 pin description ct: a capacitor is applied between this pin and ground to set the maximum fault time. the maximum fault time must be more than the time to charge external capacitance. the maximum fault time is defined as: t fault = 28 10 3 ct once the fault time is reached the output will shutdown for a time given by: t sd = 1 10 6 ct this results in a 3% duty cycle. shtdwn : the ic enters a low-power sleep mode when this pin is low and exits the sleep mode when this pin is high. vin: input voltage to the circuit breaker, ranging from 4 v to 6 v. vout: output voltage of the circuit breaker. when switched, the output voltage is approximately: v out = vin ? 220 m ? i out 5 1 8 4 2 3 6 7 ucc39161 vin shtdwn gndgndgndgnd ct output c t c load c in v in termpower bus d1 udg-99167 figure 1. typical application application information protecting the ucc39161 from voltage transients the parasitic inductance associated with the power distribution can cause a voltage spike at v in if the load current is suddenly interrupted by the ucc39161. it is important to limit the peak of this spike to less than 6 v to prevent damage to the ucc39161. this voltage spike can be minimized by: d reducing the power distribution inductance (e.g., twist the positive (+) and negative (--) leads of the power supply feeding v in , locate the power supply close to the ucc39161 or use a pcb ground plane). d decoupling v in with a capacitor, c in (refer to figure 1), located close to the vin pin. this capacitor is typically less than 1 f to limit the inrush current. d clamping the voltage at v in below 6 v with a zener diode, d1 (refer to figure 1), located close to the vin pin.
ucc39161 low current hot swap power manager slus410c -- november 1999 -- revised february 2000 4 post office box 655303 dallas, texas 75265 application information safety recommendations although the ucc39161 is designed to provide system protection for all fault conditions, all integrated circuits can ultimately fail short. for this reason, if the ucc39161 is intended for use in safety critical applications where ul or some other safety rating is required, a redundant safety device such as a fuse should be placed in series with the device. the ucc39161 prevents the fuse from blowing virtually all fault conditions, increasing system reliability and reducing maintainence cost, in addition to providing the hot-swap benefits of the device.
package option addendum www.ti.com 7-jun-2010 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) UCC39161DP obsolete soic d 8 tbd call ti call ti samples not available UCC39161DPg4 obsolete soic d 8 tbd call ti call ti samples not available (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dlp? products www.dlp.com communications and www.ti.com/communications telecom dsp dsp.ti.com computers and www.ti.com/computers peripherals clocks and timers www.ti.com/clocks consumer electronics www.ti.com/consumer-apps interface interface.ti.com energy www.ti.com/energy logic logic.ti.com industrial www.ti.com/industrial power mgmt power.ti.com medical www.ti.com/medical microcontrollers microcontroller.ti.com security www.ti.com/security rfid www.ti-rfid.com space, avionics & www.ti.com/space-avionics-defense defense rf/if and zigbee? solutions www.ti.com/lprf video and imaging www.ti.com/video wireless www.ti.com/wireless-apps mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2010, texas instruments incorporated
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